MODELING AND SIMULATION STUDIES ON TEMPERATURE FIELD IN MICRO END GRINDING
Journal: Frontiers in Manufacturing Engineering (FME)
Author: Yan Zhao, Shuo Zhang, Jianhua Zhang, Zhi Wei
This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
A significant machining method-Micro End Grinding (MEG), is used for micro parts made of hard and brittle materials in this paper. As an important parameter of the grinding process, the grinding temperature is closed to the machined surface quality and the grinding wheel wear, etc. In order to research the influence of the temperature field on MEG, the mechanism of machining process is analyzed and the finite element model of the micro end grinding temperature field is established. Based on this model, the finite element simulation experiment is conducted. From the results it can be found that a similar circular ring temperature field is forming in the grinding process of MEG. The highest surface temperature of workpiece is in the center of wheel end face. The temperature gradient increases when the workpiece surface of different position is closer to the center of wheel end face in both the direction of x and y axis. During the period when the wheel approaches and leaves the workpiece edge, the surface temperature of the workpiece edge will be higher relatively than other workpiece surface because of the heat accumulation due to workpiece boundary.